The difference between the manufacturing process of DBC and AMB ceramic board carrier

28 Mar,2023

In recent years, with the rapid development of power semiconductors, the third-generation semiconductor silicon carbide chips have the characteristics of band gap and high thermal conductivity. As a ceramic substrate chip carrier is used to carry the chip and connect to the water cooling system (soldering or sintering) in the end customer application to achieve the high heat dissipation, reliability and insulation performance required by the chip.

Ceramic plate DBC production process

26 Mar,2023

PCB ceramic substrates are widely used in electronic products such as automotive electronics, transportation tracks, semiconductors, power modules, and LEDs because of their advantages such as good heat dissipation, high insulation, high temperature resistance, and corrosion resistance. So what is the production process used in the production of PCB ceramic substrates?

IC Semiconductor Level Equipment

16 Mar,2023

At present, with the rapid popularization of electronic information industries such as mobile communications, flat panel displays, solar photovoltaics and energy-saving lighting, electronic and electrical products continue to develop in the direction of digitization, miniaturization, flexibility, multi-function, high reliability, and low energy consumption. The closely related electronic packaging technology has entered a period of ultra-high-speed development.

Process of Line Development Etching Defilm Equipment for DBC,DPC,AMB

15 Mar,2023

Ceramic circuit boards have many advantages over traditional substrate materials: therefore, ceramic materials have gradually developed into an ideal packaging substrate for a new generation of integrated circuits and power electronic modules, and ceramic circuit board packaging technology has also received widespread attention and rapid development.

Mass Production of Ceramic Plate DBC,DPC,AMB Automatic Grinding Machine

14 Mar,2023

According to the needs of the current semiconductor market, the demand for ceramic plates is increasing, the characteristics of ceramic plate substrates are more stringent, and processing is more difficult. When the ceramic plate is pre-treated, it is required to be smooth, the surface treatment is difficult, and it is easy to break. Ordinary grinding machine regardless of precision and capacity can not complete the type of processing.

Production of Semiconductor Devices on Ceramic Boards

11 Mar,2023

With the development of the electronic age and the rapid popularization of electronic information industries such as mobile communications, flat panel displays, solar photovoltaics and energy-saving lighting, electronic and electrical products continue to be digitized, miniaturized, flexible, multifunctional, high reliability, and low energy consumption. With the development of other directions, the closely related electronic packaging technology has entered a period of ultra-high-speed development. Ceramic circuit board packaging substrate material must meet the requirements: 1) High thermal conductivity, low dielectric constant, good heat resistance and pressure resistance; 2) The thermal expansion coefficient is close to the chip material Si or GaAs to avoid thermal stress damage of the chip; 3) It has sufficient strength and rigidity to support and protect the chip and electronic components; 4) The cost is as low as possible to meet the needs of large-scale industrial production applications; 5) Good processing, assembly and installation performance. Commonly used electronic packaging substrate materials include organic packaging substrates, metal matrix composite substrates and ceramic packaging substrates. Ceramic circuit boards have many advantages over traditional substrate materials: therefore, ceramic materials have gradually developed into an ideal packaging substrate for a new generation of integrated circuits and power electronic modules, and ceramic circuit board packaging technology has also received widespread attention and rapid development. Table 1 shows the performance comparison of commonly used ceramic packaging materials and Si. At present, commonly used ceramic substrate materials include Al2O3, SiC, BeO and AlN. Our company R & D production department a variety of ceramic plate equipment: 1) Ceramic grinding machine pretreatment: grinding substrate, sand scraping, polishing, pretreatment equipment 2) Ceramic plate development line, etching line, titanium removal line, film removal line, solder resist development, electroplating equipment, 3) Finished product cleaning machine

Application of vertical development etching equipment

18 Jun,2022

At present, the transmission of PCB equipment is mostly horizontal transmission, spraying up and down, which makes some problems unavoidable.

Advantages of horizontal sinking copper wire

30 Jul,2020

With the continuous development of society and the continuous progress of various industries, industrial production equipment has been continuously innovated on the original basis. Taking the circuit board processing equipment as an example, the traditional circuit board processing not only requires a lot of manual labor, but also often forms a large amount of sewage and waste gas containing metal ions, which causes great harm to the environment and water resources and also affects the health of the staff. Therefore, no matter from which aspects, we urgently need a horizontal copper wire sinking process to meet people's needs.