Process of Line Development Etching Defilm Equipment for DBC,DPC,AMB
Release time:
2023-03-15 11:18
Source:
summary:
Ceramic circuit boards have many advantages over traditional substrate materials: therefore, ceramic materials have gradually developed into an ideal packaging substrate for a new generation of integrated circuits and power electronic modules, and ceramic circuit board packaging technology has also received widespread attention and rapid development.
Ceramic circuit board packaging substrate material must meet the requirements:
1) High thermal conductivity, low dielectric constant, good heat resistance and pressure resistance;
2) The thermal expansion coefficient is close to the chip material Si or GaAs to avoid thermal stress damage of the chip;
3) It has sufficient strength and rigidity to support and protect the chip and electronic components;
4) The cost is as low as possible to meet the needs of large-scale industrial production applications;
5) Good processing, assembly and installation performance. Commonly used electronic packaging substrate materials include organic packaging substrates, metal matrix composite substrates and ceramic packaging substrates.
Ceramic circuit boards have many advantages over traditional substrate materials: therefore, ceramic materials have gradually developed into an ideal packaging substrate for a new generation of integrated circuits and power electronic modules, and ceramic circuit board packaging technology has also received widespread attention and rapid development. Table 1 shows the performance comparison of commonly used ceramic packaging materials and Si. Currently, commonly used ceramic substrate materials include Al2O3, SiC, BeO and AlN.
Our company R & D and production of a variety of ceramic board semiconductor, carrier board DBC,DPCMAMB production equipment:
Ceramic plate development line, etching line, titanium withdrawal line, film withdrawal line, solder resist development line
1) The equipment adopts vacuum etching to reduce the pool effect, reduce the etching side etching effect, and the line is more precise.
2) With the automatic control of the liquid medicine, the process operation is more scientific, simpler, and the liquid medicine is reduced.
3) The etching factor is greatly improved by more than 4.0
4) Etching copper line thickening, 100um
5) The etching uniformity reaches 96%.
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