Production of Semiconductor Devices on Ceramic Boards
Release time:
2023-03-11 10:37
Source:
summary:
With the development of the electronic age and the rapid popularization of electronic information industries such as mobile communications, flat panel displays, solar photovoltaics and energy-saving lighting, electronic and electrical products continue to be digitized, miniaturized, flexible, multifunctional, high reliability, and low energy consumption. With the development of other directions, the closely related electronic packaging technology has entered a period of ultra-high-speed development. Ceramic circuit board packaging substrate material must meet the requirements: 1) High thermal conductivity, low dielectric constant, good heat resistance and pressure resistance; 2) The thermal expansion coefficient is close to the chip material Si or GaAs to avoid thermal stress damage of the chip; 3) It has sufficient strength and rigidity to support and protect the chip and electronic components; 4) The cost is as low as possible to meet the needs of large-scale industrial production applications; 5) Good processing, assembly and installation performance. Commonly used electronic packaging substrate materials include organic packaging substrates, metal matrix composite substrates and ceramic packaging substrates. Ceramic circuit boards have many advantages over traditional substrate materials: therefore, ceramic materials have gradually developed into an ideal packaging substrate for a new generation of integrated circuits and power electronic modules, and ceramic circuit board packaging technology has also received widespread attention and rapid development. Table 1 shows the performance comparison of commonly used ceramic packaging materials and Si. At present, commonly used ceramic substrate materials include Al2O3, SiC, BeO and AlN. Our company R & D production department a variety of ceramic plate equipment: 1) Ceramic grinding machine pretreatment: grinding substrate, sand scraping, polishing, pretreatment equipment 2) Ceramic plate development line, etching line, titanium removal line, film removal line, solder resist development, electroplating equipment, 3) Finished product cleaning machine
With the development of the electronic age and the rapid popularization of electronic information industries such as mobile communications, flat panel displays, solar photovoltaics and energy-saving lighting, electronic and electrical products continue to be digitized, miniaturized, flexible, multifunctional, high reliability, and low energy consumption. With the development of other directions, the closely related electronic packaging technology has entered a period of ultra-high-speed development.
Ceramic circuit board packaging substrate material must meet the requirements:
1) High thermal conductivity, low dielectric constant, good heat resistance and pressure resistance;
2) The thermal expansion coefficient is close to the chip material Si or GaAs to avoid thermal stress damage of the chip;
3) It has sufficient strength and rigidity to support and protect the chip and electronic components;
4) The cost is as low as possible to meet the needs of large-scale industrial production applications;
5) Good processing, assembly and installation performance. Commonly used electronic packaging substrate materials include organic packaging substrates, metal matrix composite substrates and ceramic packaging substrates.
Ceramic circuit boards have many advantages over traditional substrate materials: therefore, ceramic materials have gradually developed into an ideal packaging substrate for a new generation of integrated circuits and power electronic modules, and ceramic circuit board packaging technology has also received widespread attention and rapid development. Table 1 shows the performance comparison of commonly used ceramic packaging materials and Si. At present, commonly used ceramic substrate materials include Al2O3, SiC, BeO and AlN.
Our company R & D and production of a variety of ceramic board semiconductor, carrier board production equipment:
1) Ceramic grinding machine pretreatment: grinding substrate, sand scraping, polishing, pretreatment equipment
2) Ceramic plate development line, etching line, titanium withdrawal line, film withdrawal line, solder resist development, grinding plate sandblasting line, electroplating equipment,
3) Anti-oxidation equipment, finished product cleaning equipment
4) Silver wire
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Shenzhen address: 201, Building 2, Xinweirun High tech Park, No. 3 Shajiang Road, Xitou Community, Songgang Street, Bao'an District, Shenzhen.
Zhuhai address: Building 10, No. 111 Qilu, Qianwu Town, Zhuhai
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