The difference between the production process of ceramic plate DPC LTCC and HTCC
04 May,2023
Ceramic plate production process diversification, DBC,DPC,AMB,HTCC
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Grinding Technology of Ceramic Plate (DBC,DPC,AMB) Substrate
12 Apr,2023
DPC ceramic substrate has the advantages of good thermal conductivity/heat resistance, high pattern accuracy, vertical interconnection and other technical advantages, widely used in power semiconductor lighting (white LED), sterilization (deep ultraviolet LED), laser and optical communication (LD & VCSEL), thermoelectric refrigeration (TEC) and other fields.
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The whole process of DPC ceramic board and the introduction of required equipment
31 Mar,2023
DPC ceramic substrate has the characteristics of high line accuracy, high surface flatness, high insulation and high thermal conductivity, and has rapidly occupied an important market position in the field of semiconductor power device packaging, and is widely used in high-power LED, semiconductor laser, VCSEL and other fields.
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The difference between the manufacturing process of DBC and AMB ceramic board carrier
28 Mar,2023
In recent years, with the rapid development of power semiconductors, the third-generation semiconductor silicon carbide chips have the characteristics of band gap and high thermal conductivity. As a ceramic substrate chip carrier is used to carry the chip and connect to the water cooling system (soldering or sintering) in the end customer application to achieve the high heat dissipation, reliability and insulation performance required by the chip.
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Ceramic plate DBC production process
26 Mar,2023
PCB ceramic substrates are widely used in electronic products such as automotive electronics, transportation tracks, semiconductors, power modules, and LEDs because of their advantages such as good heat dissipation, high insulation, high temperature resistance, and corrosion resistance. So what is the production process used in the production of PCB ceramic substrates?
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The production method of the backlit FPC black hole plate surface indentation device is described.
11 May,2020
The FPC black hole line is a highly reliable and excellent flexible printed circuit board made of polyimide or polyester film. In the production process, it has the characteristics of high wiring density, light weight, thin thickness and good bending property. In order to prevent too many open and short circuits from causing too low yield or reduce the problems of scrapping and replenishing FPC black-hole wire boards caused by rough process problems such as drilling, calendering and cutting, and to evaluate how to select materials to achieve the best results for customers, prenatal pretreatment is especially important. The thick thickness of the copper plate used on the traditional FPC can not effectively conduct information, but also increase the volume of the circuit board, and the traditional production process of FPC will produce indentation on the board, but can not effectively deal with the indentation, seriously affecting the appearance of the board. To this end, we designed a new type of backlit FPC black hole plate surface indentation device, which solved the problem of the inconvenience of the traditional backlit FPC black hole plate surface indentation device.
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