IC Semiconductor Level Equipment
Release time:
2023-03-16 10:54
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summary:
At present, with the rapid popularization of electronic information industries such as mobile communications, flat panel displays, solar photovoltaics and energy-saving lighting, electronic and electrical products continue to develop in the direction of digitization, miniaturization, flexibility, multi-function, high reliability, and low energy consumption. The closely related electronic packaging technology has entered a period of ultra-high-speed development.
At present, with the rapid popularization of electronic information industries such as mobile communications, flat panel displays, solar photovoltaics and energy-saving lighting, electronic and electrical products continue to develop in the direction of digitization, miniaturization, flexibility, multi-function, high reliability, and low energy consumption. The closely related electronic packaging technology has entered a period of ultra-high-speed development.
Therefore, ceramic materials have gradually developed into an ideal packaging substrate for a new generation of integrated circuits and power electronic modules, and ceramic circuit board packaging technology has also received extensive attention and rapid development. Table 1 shows the performance comparison of commonly used ceramic packaging materials and Si. Currently, commonly used ceramic substrate materials include Al2O3, SiC, BeO and AlN.
Ceramic circuit board packaging substrate materials must meet the requirements Therefore, ceramic materials have gradually developed into a new generation of integrated circuits and power electronic modules of the ideal packaging substrate, ceramic circuit board packaging technology has also been widespread concern and rapid development. Table 1 shows the performance comparison of commonly used ceramic packaging materials and Si. Currently, commonly used ceramic substrate materials include Al2O3, SiC, BeO and AlN.
1) High thermal conductivity, low dielectric constant, good heat resistance and pressure resistance;
2) The thermal expansion coefficient is close to the chip material Si or GaAs to avoid thermal stress damage of the chip;
3) It has sufficient strength and rigidity to support and protect the chip and electronic components;
4) The cost is as low as possible to meet the needs of large-scale industrial production applications;
5) Good processing, assembly and installation performance. Commonly used electronic packaging substrate materials include organic packaging substrates, metal matrix composite substrates and ceramic packaging substrates.
Shenzhen Feishida Mechanical Equipment Co., Ltd. produces grinding machine, sand scraping machine, polishing machine, developing machine, vacuum etching machine, titanium withdrawal machine, finished product cleaning machine, anti-oxidation machine and horizontal silver sinking machine. Red coating machine, red washing machine, to meet the various processes of the carrier board.
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Shenzhen address: 201, Building 2, Xinweirun High tech Park, No. 3 Shajiang Road, Xitou Community, Songgang Street, Bao'an District, Shenzhen.
Zhuhai address: Building 10, No. 111 Qilu, Qianwu Town, Zhuhai
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