Ceramic plate DBC production process

production process of pcb ceramic substrate

PCB ceramic substrates are widely used in electronic products such as automotive electronics, transportation tracks, semiconductors, power modules, and LEDs because of their advantages such as good heat dissipation, high insulation, high temperature resistance, and corrosion resistance. So what is the production process used in the production of PCB ceramic substrates?

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　　First, direct copper plating ceramic substrate (Direct Plated Copper Ceramic,DPC) process

The DPC substrate has the advantages of high pattern accuracy and vertical interconnection, and is mainly used in high-power packaging.

　　Second, direct bonding copper ceramic substrate (Direct Bonded Copper Ceramic,DBC) process

DBC line layer is thick, good heat resistance, mainly used in high power, large temperature change IGBT packaging.

　　Third, thick film printed ceramic substrate (Thick Printing Ceramic,TPC) process

TPC thick film ceramic substrate has good heat resistance and low cost, but the circuit layer accuracy is poor. It is mainly used in automotive sensors and other fields.

　　Fourth, thin film ceramic substrate (ThinFilm Ceramic,TFC) process

Among the planar ceramic substrates, the thin film ceramic substrate TFC substrate has high pattern accuracy, but the metal layer is thin, which is mainly used in the packaging of small current optoelectronic devices.

　　Five, AMB active brazing process

The AMB substrate has a thicker circuit layer and good heat resistance, and is mainly used in IGBT packaging with high power and large temperature change.

　　 six, multilayer htcc high temperature co-firing process

The high-temperature co-fired ceramic material is mainly alumina, mullite and aluminum nitride-based ceramic, and the ceramic powder of HTCC does not add glass material. The conductive paste is made of tungsten, molybdenum, molybdenum, manganese and other high melting point metal heating resistor paste. The sintering temperature is between 1600 ° and 1800 °. HTCC substrate has the advantages of high structural strength, high thermal conductivity, good chemical stability and high wiring density, so it has a wide application prospect in high-power micro-assembly circuit.

　　seven, multilayer ltcc low temperature co-firing process

Low-Temperature Co-fired Ceramics In order to ensure a high sintering density under low-temperature co-fired conditions, amorphous glass, crystallized glass, low-melting point oxides, etc. are usually added to the composition to promote sintering. Glass and ceramic composite is a typical low temperature co-fired ceramic material. In addition, there are crystallized glass, composites of crystallized glass and ceramics, and liquid phase sintered ceramics. The sintering temperature is 900 ° ~ 1000 °, and LTCC uses Au, Ag, Cu and other metals with high conductivity and low melting point as conductor materials. Due to the low dielectric constant and low loss performance at high frequency, glass ceramics are very suitable for RF, Microwave and millimeter wave devices. Mainly used in the field of high-frequency wireless communications, aerospace, memory, drivers, filters, sensors and automotive electronics and other fields.

Summary: In double-sided ceramic substrates, DPC ceramic substrates have the characteristics of high circuit accuracy, high surface flatness, high insulation and high thermal conductivity, and quickly occupy an important market position in the field of semiconductor power device packaging. They are widely used in high-power LEDs, semiconductor lasers, VCSELs and other fields, in line with the future development direction of high density, high precision and high reliability. In the production of multilayer ceramic substrates, the HTCC process and LTCC process are mostly used, and the application is more complex in the field of devices.

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