Grinding Technology of Ceramic Plate (DBC,DPC,AMB) Substrate
Release time:
2023-04-12 10:13
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summary:
DPC ceramic substrate has the advantages of good thermal conductivity/heat resistance, high pattern accuracy, vertical interconnection and other technical advantages, widely used in power semiconductor lighting (white LED), sterilization (deep ultraviolet LED), laser and optical communication (LD & VCSEL), thermoelectric refrigeration (TEC) and other fields.
Surface Lapping Technology of DPC Ceramic Substrate
DPC ceramic substrate has the advantages of good thermal conductivity/heat resistance, high pattern accuracy, vertical interconnection and other technical advantages, widely used in power semiconductor lighting (white LED), sterilization (deep ultraviolet LED), laser and optical communication (LD & VCSEL), thermoelectric refrigeration (TEC) and other fields.
Our company's automatic plate grinding machine, ceramic plate brushing machine, ceramic plate belt grinding, ceramic plate belt grinding, ceramic plate mechanical grinding, etc.: suitable for ceramic plate process: substrate grinding, substrate glue removal, copper surface leveling, copper surface polishing, slag scraping, dry film pretreatment
The preparation process of DPC ceramic substrate is shown in the figure above, which mainly includes:
1) Sputtering a metal seed layer (Ti/Cu) on a ceramic substrate;
2) paste photosensitive dry film;
3) through exposure, development, forming graphics;
4) Use graphic plating process to thicken the copper layer;
5) substrate surface grinding (control of copper layer thickness and uniformity);
6) to dry film, etching seed layer, the final surface treatment (such as chemical silver or nickel gold, etc.).
InIn the preparation process of DPC ceramic substrate, due to the uneven distribution of electroplating current, the thickness of the electroplated copper layer on the surface of the substrate is uneven (the thickness difference can be more than 100 μm). Surface grinding is the key process to control the thickness of the electroplated copper layer and improve the uniformity of the thickness of the copper layer, which directly affects the performance of the ceramic substrate and the quality of the device package.
Due to the good ductility of copper materials, plastic deformation (scratches or copper skin) is easy to occur during the grinding process, and the grinding process is extremely challenging. The copper layer on the surface of the DPC ceramic substrate is ground, and there are four main grinding techniques available:
1) Abrasive belt grinding
Abrasive belt grinding is a commonly used metal surface roughing technology. It uses abrasive belt rollers with abrasive surface to quickly grind the samples on the conveyor belt, and the grinding efficiency is high.
The grinding rate of abrasive belt grinding is obviously higher than that of numerical control grinding and ceramic brush grinding, but the grinding surface roughness is larger and the thickness uniformity is also poor. And the edge of the copper layer appears obvious plastic deformation caused by the incomplete phenomenon.
2) Ceramic brush grinding
Ceramic brush grinding is the use of high-speed rotating roller surface ceramic/diamond composite abrasive, the conveyor belt at a certain speed of movement of the ceramic substrate grinding. Since the pressure sensor on the roller can control the grinding pressure and the buffering effect of the rubber, the ceramic brush grinding can effectively control the thickness and uniformity of the copper layer on the substrate surface.
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Shenzhen address: 201, Building 2, Xinweirun High tech Park, No. 3 Shajiang Road, Xitou Community, Songgang Street, Bao'an District, Shenzhen.
Zhuhai address: Building 10, No. 111 Qilu, Qianwu Town, Zhuhai
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