The difference between the production process of ceramic plate DPC LTCC and HTCC

Shenzhen feishida mechanical equipment co., ltd. develops, produces and sells various equipment for ceramic plates: developing machine, etching machine, titanium withdrawal machine, oxidation resistance, plate grinding machine, silver sinking wire, electroplating wire, copper sinking wire, finished product cleaning machine, slag scraping machine, polishing machine, copper reduction machine: suitable for DBC,DPC,AMB,LTCC,HTCC, etc.

DPC ceramic substrate and Ltcc,HTCC ceramic substrate production process and characteristics of the following points:

　　1,DPC ceramic substrate and process characteristics

DPC ceramic substrate adopts DPC manufacturing process. Because DPC ceramic substrate uses direct copper plating (DPC) process, evaporation, magnetron sputtering and other surface deposition processes are mainly used to metallize the surface of the substrate. First, titanium is sputtered under vacuum conditions, chromium is sputtered, then copper particles are plated and thickened, then the circuit is fabricated by common pcb process, and finally the thickness of the circuit is increased by electroplating/chemical plating deposition.

DPC ceramic substrate adopts DPC-magnetron sputtering plating process with high precision and high equipment cost. DBC process-copper is directly sintered to ceramic plate, direct printing-thick film process equipment is cheap, mature process and high precision. Good flatness, good bonding force, and can be through holes. The disadvantage is that this technology can only produce thin plates (thickness <300 μm), and its cost is high, the output is limited, resulting in frequent shipment time can not be on time.

The DPC process is more suitable for ceramic circuit boards with precision circuits, more holes and smaller line width and line spacing. In line with the future development of science and technology miniaturization, high integration, intelligent requirements. General DPC is more suitable for the production of single-sided ceramic substrate, one side of the other side of the circuit, or double-sided circuit, double-sided metal copper layer.

　　2,LTCC ceramic substrate process introduction and characteristics advantages

The LTCC ceramic substrate adopts the LTCC process, which is a low-temperature co-fired ceramic process. Generally, double-sided or multi-layer ceramic substrates are made. The process is relatively complicated, the manufacturing process is difficult, and the yield is less. Low temperature co-fired ceramic substrate because of low temperature sintering, the production of ceramic substrate thermal conductivity is reduced. But the ltcc ceramic substrate has its own advantages:

It can adapt to the requirements of high current and high temperature resistance, and has excellent thermal conductivity than ordinary PCB circuit substrate;

The use of metal materials with high conductivity as conductor materials is conducive to improving the quality factor of the circuit system;

Good temperature characteristics, such as a small thermal expansion coefficient, a small dielectric constant temperature coefficient, can produce a circuit substrate with a very high number of layers, and can produce a thin line structure with a line width of less than 50 μm.

Passive components can be embedded in the multi-layer circuit substrate, which is beneficial to improve the assembly density of the circuit;

The discontinuous production process allows the green substrate to be inspected, thereby increasing the yield and reducing production costs.

It can be seen that the production process of dpc and ltcc ceramic substrates is different, and the advantages are also different. Multilayer ceramic substrates are generally made of ltcc process or htcc process. dpc can only be made of thin plates at present, and multilayer ceramic substrates are limited.

　　3. The thermal conductivity of dpc ceramic substrate is different from that of Ltcc substrate

The dpc ceramic substrate is processed by the dpc electroplating process, and the thermal conductivity of the plate is not affected. The DPC ceramic substrate is widely used in the product field that requires high thermal conductivity and heat dissipation. However, the LTCC ceramic substrate uses a low-temperature co-firing process, and the LTCC sintering temperature is generally below 1000°C. LTCC uses Au, Ag, Cu and other metals with high conductivity and low melting point as conductor materials. Due to the low dielectric constant and low loss performance at high frequency, glass ceramics are very suitable for radio frequency, microwave and millimeter wave devices. Mainly used in the field of high-frequency wireless communications, aerospace, memory, drivers, filters, sensors and automotive electronics and other fields.

　　4,dpc ceramic substrate and ltcc substrate processing process is different

The DPC process is simpler than the LTCC process, with higher yield and faster delivery. LTCC substrate manufacturing process is more complex, higher cost, longer delivery time.

To sum up, it is the "difference between dpc ceramic substrate and ltcc" shared by Xiaobian. ltcc is low-temperature sintering, which is generally used for multilayer interconnection and is very popular in the field of high-frequency communication. The dpc ceramic substrate has high precision and outstanding thermal conductivity, and is mostly made of single-sided and double-sided boards.

　　Difference Between LTCC and HTCC

HTCC high-temperature co-fired ceramic materials are mainly alumina, mullite and aluminum nitride-based ceramics, and HTCC ceramic powder does not add glass material. The conductive paste is made of tungsten, molybdenum, molybdenum, manganese and other high melting point metal heating resistor paste.

LTCC low-temperature co-fired ceramics In order to ensure a high sintering density under low-temperature co-fired conditions, amorphous glass, crystallized glass, low-melting point oxides, etc. are usually added to the composition to promote sintering. Glass and ceramic composite is a typical low temperature co-fired ceramic material. In addition, there are crystallized glass, composites of crystallized glass and ceramics, and liquid phase sintered ceramics. The metal used is a highly conductive material (Ag, Cu, Au and alloys thereof, such as Ag-Pd, Ag-Pt, Au-Pt, etc.).

The overall process flow of LTCC and HTCC is very similar, and the equipment required is similar. However, due to the large difference in materials, the co-firing temperature of LTCC and HTCC in the production process is quite different. The general sintering temperature of HTCC is above 1650 ℃, while the general sintering temperature of LTCC is below 950 ℃.

LTCC uses Au, Ag, Cu and other metals with high conductivity and low melting point as conductor materials. Due to the low dielectric constant and low loss performance at high frequency, glass ceramics are very suitable for radio frequency, microwave and millimeter wave devices. Mainly used in the field of high-frequency wireless communications, aerospace, memory, drivers, filters, sensors and automotive electronics and other fields.

Commonly used LTCC electronic components include filters, duplexers, antennas, baluns, couplers, power dividers, common mode chokes, etc., which are widely used in mobile communication terminals, WiFi, automotive electronics, T/R components and other fields.

Due to the high firing temperature, HTCC can not use gold, silver, copper and other low melting point metal materials, must use tungsten, molybdenum, manganese and other refractory metal materials, these materials have low conductivity, will cause signal delay and other defects, so it is not suitable for high-speed or high-frequency micro-assembly circuit substrate. However, the HTCC substrate has the advantages of high structural strength, high thermal conductivity, good chemical stability and high wiring density, so it has a wide range of applications in high-power micro-assembly circuits.

HTCC ceramic substrates are widely used in high-reliability microelectronic integrated circuits, high-power micro-assembly circuits, vehicle-mounted high-power circuits and other fields due to their high thermal conductivity, good structural strength and stable physical and chemical properties.