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Line processing
PCB/FPC horizontal development line: basic process: plate entering development supplement development hot water washing overflow water washing suction drying drying plate making ability: 0.05~3.0 plate thickness, 2/2 dense line, high development point. Uniformity is strong. Suitable for HDI and multi-layer line fine line processing. Coupled with imported automatic adding system, the development effect is greatly improved
Pre-solder resist (ultra-roughening) treatment line
Pre-treatment of horizontal solder resist: capacity: 0.035~0.2 plate thickness, production rate of 6 m/min. Into the plate pickling washing grinding plate sandblasting ultra-roughening treatment ultrasonic washing drying plate, suitable for HDI and multi-layer line fine line processing. Break the traditional equipment process, so that the ink binding force is strengthened, will not be short-circuited, bridge drop, scrap rate is reduced, production quality is greatly enhanced.
Solder resist development line
Solder resist development line, unique roller arrangement, unique spray plate design, fast development speed, high development point. No bridge off, no oil film. Easy to clean. It is due to the production of fine lines.
Our company designs an automatic high-precision grinding brush machine, which is suitable for HDI resin plug hole grinding plate, copper reduction grinding plate, line pretreatment and solder resist pretreatment. It belongs to a multi-function grinding machine with controllable precision of 0.01MM, automatic whole brush function, automatic plate thickness measurement function, automatic brush start, plate head and plate tail automatic brush lifting function, automatic whole brush, and automatic brush loss alarm function.