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Line processing
DBC,DPC ,AMB Ceramic Semiconductor Equipment
Our company develops and produces a variety of ceramic semiconductor special equipment, unique design, unique production. It is suitable for various processes of ceramic plates: DBC,DPC,AMB, etc., development line, vacuum etching line, film removal line, titanium removal line, red coating line, red washing line, OSP, silver chemical line, grinding plate, slag scraping, polishing, copper reduction, leveling of various materials of ceramic plates, with single brush, double brush and four brushes in different combinations. Meet different manufacturers, different products, different output of the whole process equipment.
Automatic plate grinding machine
Full-automatic grinding machine, precision grinding plate, suitable for PCB,FPC,HDI, ceramic carrier plate, deburring, line pretreatment, solder resist pretreatment, electroplating pretreatment, copper reduction treatment, resin plug hole grinding plate. Automatic pressure regulation, automatic whole brush, automatic plate thickness measurement, card alarm, automatic adjustment of transmission sprocket. Small vibration, small noise characteristics.
Horizontal black hole line (eclipse line)
Soft board and hard board (black hole line): capacity: 0.035~3.0 board thickness, production speed up to 3~5 m/min. Suitable for soft board, fine hole processing. Special water knife arrangement, special wheel plate arrangement, special spray forest design, special overflow structure, to achieve no indentation, no wheel marks. Roll-to-roll and sheet-to-sheet co-production, easy to switch, production capacity increased. Intelligent production, plate collection, plate release, intelligent liquid medicine control, greatly reduce the cost, liquid medicine life extension.
Shenzhen address: 201, Building 2, Xinweirun High tech Park, No. 3 Shajiang Road, Xitou Community, Songgang Street, Bao'an District, Shenzhen.
Zhuhai address: Building 10, No. 111 Qilu, Qianwu Town, Zhuhai
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