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Line processing
Pre-dry film (pre-solder mask) treatment line
Pretreatment line for solder mask: 0.035~4.0 plate thickness, speed 5 m 1 min, can be combined into various processes according to customer requirements: grinding plate sandblasting, grinding plate ultra-coarsening, sandblasting ultra-coarsening. Application: multi-layer board, HDI carrier board, hard and soft combination and other high-end requirements.
Full-automatic pressure regulating grinding machine
Fully automatic pressure regulating grinding machine: capacity: 0.3~4.0 plate thickness. Suitable for HDI and multi-layer circuit reduction copper, de-resin grinding plate. Automatic pressure regulation, front and rear lifting brush, prevent plate rolling from rotten plate, one-button automatic whole brush, card plate turnover, brush grinding life alarm and other functions.
Gold pretreatment: grinding plate sandblasting structure, capacity: 0.2~3.0 plate thickness, production rate of 3 m/min. Suitable for advanced board surface, fine processing. Special spray forest design, to achieve no color, no leakage sand structure. Stable performance!
Deburring (before copper sinking) processing line
Equipment after material opening: deburring, pretreatment of copper sinking, ultrasonic cleaning after grinding plate, ultra-high pressure water washing (100KG), completely remove impurities in the hole.
Shenzhen address: 201, Building 2, Xinweirun High tech Park, No. 3 Shajiang Road, Xitou Community, Songgang Street, Bao'an District, Shenzhen.
Zhuhai address: Building 10, No. 111 Qilu, Qianwu Town, Zhuhai
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