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Line processing
Horizontal vacuum etching line: capacity: 0.05~4.0 plate thickness, yield up to 5 m/min. Vacuum etching, the etching factor is above 4.0, and the etching uniformity is 96%. Suitable for fine lines of 2MI * 2MILd. Ultrasonic vibration, high pressure water washing, high pressure film, drum collection film slag, squeeze dry function.
The shadow process is suitable for high-end FPC,5G products, and the mainstream process of high-end PFC, which is increasingly adopted by high-end FPC manufacturers. At present, the market mainly represents the potion merchants: Medemei, Les. Shenzhen Feishida Machinery Equipment Company and Medemei Company have successfully cooperated with many pieces of equipment, and many companies are in mass production.
Automatic plate grinding machine
Our company's own research and development, design, production and sales, full-automatic precision plate grinding machine, automatic pressure regulation, automatic plate thickness measurement, mute production, suitable for: PCB,FPC,HDI, ceramic plate and other plate grinding processes: deburring, solder resist pretreatment, line pretreatment, polishing, etc.
Our company produces and sells, grinding plate sandblasting line, suitable for: PCB,FPC solder resist pre-treatment, sandblasting pre-treatment, finished product cleaning machine