Pre-dry film (pre-solder mask) treatment line
Pretreatment line for solder mask: 0.035~4.0 plate thickness, speed 5 m 1 min, can be combined into various processes according to customer requirements: grinding plate sandblasting, grinding plate ultra-coarsening, sandblasting ultra-coarsening. Application: multi-layer board, HDI carrier board, hard and soft combination and other high-end requirements.
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Surface treatment
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Pre-dry film (pre-solder mask) treatment line
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Pretreatment line for solder mask: 0.035~4.0 plate thickness, speed 5 m 1 min, can be combined into various processes according to customer requirements: grinding plate sandblasting, grinding plate ultra-coarsening, sandblasting ultra-coarsening. Application: multi-layer board, HDI carrier board, hard and soft combination and other high-end requirements.
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