Horizontal DES
Classification:
Inner layer processing
Products
Line processing
Keyword:
Horizontal DES
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Horizontal DES line: capacity: 0.05~4.0 plate thickness, production rate up to 5 m/min. Ultrasonic vibration, high-pressure water washing, high-pressure film withdrawal, roller collection of film slag, vacuum etching line, uniform up to 96%, etching factor up to 4.0. Equipped with automatic etching addition function.
Horizontal vacuum etching line: capacity: 0.05~4.0 plate thickness, yield up to 5 m/min. Vacuum etching, the etching factor is above 4.0, and the etching uniformity is 96%. Suitable for fine lines of 2MI * 2MILd. Ultrasonic vibration, high pressure water washing, high pressure film, drum collection film slag, squeeze dry function.
Horizontal vacuum etching line: capacity: 0.05~4.0 plate thickness, yield up to 5 m/min. Vacuum etching is used to reduce the pool effect and side etching. The etching factor is above 4.0, and the etching uniformity is 96%. Suitable for fine lines of 2MI * 2MILd. Ultrasonic vibration, high pressure water washing, high pressure film, drum collection film slag, squeeze dry function.
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