Products

Horizontal DES

Horizontal vacuum etching line: capacity: 0.05~4.0 plate thickness, yield up to 5 m/min. Vacuum etching, the etching factor is above 4.0, and the etching uniformity is 96%. Suitable for fine lines of 2MI * 2MILd. Ultrasonic vibration, high pressure water washing, high pressure film, drum collection film slag, squeeze dry function.

Classification:

Inner layer processing

Products

Line processing

Keyword:

Horizontal DES

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