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Inner layer processing
Cleaning processing line after cutting and grinding
Finished product cleaning line: capacity: 0.5~4.0 plate thickness, production rate of 3 m/min. Ultrasonic concussion, high-pressure water washing, water quality testing, to prevent oxidation, suitable for finished plate processing.
Film cleaning line: capacity: 0.5~2.0 plate thickness, production speed of 3 m/min. Ultrasonic concussion, high-pressure water washing, water quality testing, to prevent oxidation, suitable for finished plate processing.
High precision development line
The inner DES line designed by our company; Development + vacuum precision etching + high-pressure film removing line realizes automatic connection, high precision vacuum etching, etching factor reaches 4.5, uniformity reaches 95%, plate thickness 0.05~3.2MM, line width: 2MIL/2MIL. Equipped with Japan imported automatic adding system, monitoring each section of the liquid medicine, to achieve development, etching, de-film automatic pressure adjustment, monitoring. Automation capabilities, and unmanned formation greatly improved. Suitable for HDI, high-density multilayer, packaging substrates, etc.
DES (developing and etching film removing line)
The inner DES line designed by our company; Development + vacuum precision etching + high-pressure film removing line realizes automatic connection, high precision vacuum etching, etching factor reaches 4.5, uniformity reaches 95%, plate thickness 0.05~3.2MM, line width: 2MIL/2MIL. Equipped with Japan imported automatic adding system, monitoring each section of the liquid medicine, to achieve development, etching, de-film automatic pressure adjustment, monitoring. Automation capabilities, and unmanned formation greatly improved. Suitable for HDI, high-density multilayer, packaging substrates, etc.
Shenzhen address: 201, Building 2, Xinweirun High tech Park, No. 3 Shajiang Road, Xitou Community, Songgang Street, Bao'an District, Shenzhen.
Zhuhai address: Building 10, No. 111 Qilu, Qianwu Town, Zhuhai
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