Products

Inner layer processing

Gold pretreatment line

Gold pretreatment: grinding plate sandblasting structure, capacity: 0.2~3.0 plate thickness, production rate of 3 m/min. Suitable for advanced board surface, fine processing. Special spray forest design, to achieve no color, no leakage sand structure. Stable performance!

Gold pretreatment line

Deburring (before copper sinking) processing line

Equipment after material opening: deburring, pretreatment of copper sinking, ultrasonic cleaning after grinding plate, ultra-high pressure water washing (100KG), completely remove impurities in the hole.

Deburring (before copper sinking) processing line

Inner layer pre-treatment

Pre-layer treatment: plate thickness: 0.05~4mm, after special micro-etching treatment, high-precision circuit, suitable for HDI and multi-layer circuit treatment.

Inner layer pre-treatment

Steel plate grinding plate cleaning line

Steel plate cleaning line: capacity: 1.5~4.0 plate thickness, production rate of 20 m/min. After pressing, the steel plate shall be polished and cleaned. Or coating centrifugal agent process. Complete removal of steel plate residues, and flow of glue. The pressed steel plate is injury-free and has a longer life. Pressing quality improvement

Steel plate grinding plate cleaning line

< 1...78910 > proceed page