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Inner layer processing
Horizontal black hole line (eclipse line)
Automatic connection of horizontal black hole line for removing glue residue: processing capacity: 0.035~1.0 plate thickness, production rate up to 4 m/min. Suitable for HDI and soft board, multi-layer line fine line processing. With pre-treatment, descaling, black holes, automatic connection, greatly saving manpower and maximizing production capacity. The special design of roller arrangement and wind knife arrangement, and the implementation of juan-to-roll and piece-to-piece coexistence design, can not only roll-to-roll, but also piece-to-piece, no pressure point, no wheel mark, greatly improve the output, is the first in the industry.
Copper Reduction Production Line
Horizontal copper reduction is suitable for HDI, multi-layer, soft and hard combination, carrier plate production, copper reduction or browning. Do board size: 700*700MM. Thinnest: 0.035MM Thick: 8.0MM
Shenzhen address: 201, Building 2, Xinweirun High tech Park, No. 3 Shajiang Road, Xitou Community, Songgang Street, Bao'an District, Shenzhen.
Zhuhai address: Building 10, No. 111 Qilu, Qianwu Town, Zhuhai
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