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High precision development line
High precision development line

High precision development line

The inner DES line designed by our company; Development + vacuum precision etching + high-pressure film removing line realizes automatic connection, high precision vacuum etching, etching factor reaches 4.5, uniformity reaches 95%, plate thickness 0.05~3.2MM, line width: 2MIL/2MIL. Equipped with Japan imported automatic adding system, monitoring each section of the liquid medicine, to achieve development, etching, de-film automatic pressure adjustment, monitoring. Automation capabilities, and unmanned formation greatly improved. Suitable for HDI, high-density multilayer, packaging substrates, etc.

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Inner layer processing

Keyword:

High precision development line

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The inner DES line designed by our company; Development + vacuum precision etching + high-pressure film removing line realizes automatic connection, high precision vacuum etching, etching factor reaches 4.5, uniformity reaches 95%, plate thickness 0.05~3.2MM, line width: 2MIL/2MIL. Equipped with Japan imported automatic adding system, monitoring each section of the liquid medicine, to achieve development, etching, de-film automatic pressure adjustment, monitoring. Automation capabilities, and unmanned formation greatly improved. Suitable for HDI, high-density multilayer, packaging substrates, etc.

Key words:

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Horizontal film washing line

DES (developing and etching film removing line)

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