All Categories
Inner layer processing
Non-contact vertical development etching line
At present, most of the transmission of PCB equipment is horizontally transmitted, spraying up and down, which makes some problems unavoidable.
Ceramic Plate, DBC,DPC,AMB Automatic Plate Grinding Machine
Various processes of ceramic plates: such as DBC,DPC,AMB, substrate grinding, copper surface grinding, slag scraping, glue scraping, surface roughening, copper reduction, substrate reduction, dry film pretreatment, and leveling after electroplating.
Horizontal super-coarsening line
The ultra-roughening process is a unique and new process that can be used in the production of printed circuit boards to improve the bonding of dry film/ink to copper layers. Due to the increased complexity of printed circuit boards, including ultra-fine line width/line spacing and micro-via or blind via technology, and the application of new selective surface treatment processes, proper dry film/ink adhesion has become a key requirement.
Horizontal deburring conductive film (conductive adhesive) line
Our company R & D, production and sales, metal hole equipment: deburring conductive film equipment, also known as direct electroplating. Or conductive glue black hole line. Instead of sink copper wire and black hole wire.
Horizontal deburring conductive film (conductive adhesive) line
Shenzhen address: 201, Building 2, Xinweirun High tech Park, No. 3 Shajiang Road, Xitou Community, Songgang Street, Bao'an District, Shenzhen.
Zhuhai address: Building 10, No. 111 Qilu, Qianwu Town, Zhuhai
Sweep and add WeChat
Copyright @ Shenzhen Feishida Machinery Equipment Co., Ltd.
Business License
