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Horizontal super-coarsening line

The ultra-roughening process is a unique and new process that can be used in the production of printed circuit boards to improve the bonding of dry film/ink to copper layers. Due to the increased complexity of printed circuit boards, including ultra-fine line width/line spacing and micro-via or blind via technology, and the application of new selective surface treatment processes, proper dry film/ink adhesion has become a key requirement.

Classification:

Products

Inner layer processing

Line processing

Surface treatment

Keyword:

Horizontal super-coarsening line

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Graphic Details

Chemical ultra-roughening is used to treat the roughened surface to increase the binding force with the dry film. However, the essence of chemical ultra-roughening is that organic acids and copper surface form a uniform and fine organic metal rough surface. The ultra-roughened film on the plate surface is difficult to clean during film withdrawal. When resin plug holes are made after film withdrawal, the residual ultra-roughened film has high affinity with ink, it is easy to absorb the ink in the orifice, resulting in poor plug holes and incomplete plug holes, affecting subsequent copper sinking and plate electricity, and eventually causing the resin plug holes to fail to cover.

Medium coarsening: super coarsening of hydrogen peroxide, which is commonly called medium coarsening hydrogen peroxide micro-inhibitor in the market. After micro-etching, a uniform micro-rough copper surface can be obtained, and there is no oxidation point. It can enhance the bonding force of anti-welding green oil, inner wet ink, outer dry film and the board, so that the yield can be improved. It is widely used in inner layer pretreatment, PTH micro-etching, anti-welding and tin spraying.

Ultra-roughening process: pickling> washing> grinding plate> washing> ultra-roughening> washing> pickling> washing> drying

Key words:

Ceramic Plate, DBC,DPC,AMB Automatic Plate Grinding Machine

Horizontal deburring conductive film (conductive adhesive) line

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