Inner layer pre-treatment
Pre-layer treatment: plate thickness: 0.05~4mm, after special micro-etching treatment, high-precision circuit, suitable for HDI and multi-layer circuit treatment.
Classification:
Inner layer processing
Keyword:
Inner layer pre-treatment
Graphic Details
Pre-layer treatment: plate thickness: 0.05~4mm, after special micro-etching treatment, high-precision circuit, suitable for HDI and multi-layer circuit treatment.
Key words:
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