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Film cleaning line: capacity: 0.5~2.0 plate thickness, production speed of 3 m/min. Ultrasonic concussion, high-pressure water washing, water quality testing, to prevent oxidation, suitable for finished plate processing.
High precision development line
The inner DES line designed by our company; Development + vacuum precision etching + high-pressure film removing line realizes automatic connection, high precision vacuum etching, etching factor reaches 4.5, uniformity reaches 95%, plate thickness 0.05~3.2MM, line width: 2MIL/2MIL. Equipped with Japan imported automatic adding system, monitoring each section of the liquid medicine, to achieve development, etching, de-film automatic pressure adjustment, monitoring. Automation capabilities, and unmanned formation greatly improved. Suitable for HDI, high-density multilayer, packaging substrates, etc.
DES (developing and etching film removing line)
The inner DES line designed by our company; Development + vacuum precision etching + high-pressure film removing line realizes automatic connection, high precision vacuum etching, etching factor reaches 4.5, uniformity reaches 95%, plate thickness 0.05~3.2MM, line width: 2MIL/2MIL. Equipped with Japan imported automatic adding system, monitoring each section of the liquid medicine, to achieve development, etching, de-film automatic pressure adjustment, monitoring. Automation capabilities, and unmanned formation greatly improved. Suitable for HDI, high-density multilayer, packaging substrates, etc.
Horizontal black hole line (eclipse line)
Automatic connection of horizontal black hole line for removing glue residue: processing capacity: 0.035~1.0 plate thickness, production rate up to 4 m/min. Suitable for HDI and soft board, multi-layer line fine line processing. With pre-treatment, descaling, black holes, automatic connection, greatly saving manpower and maximizing production capacity. The special design of roller arrangement and wind knife arrangement, and the implementation of juan-to-roll and piece-to-piece coexistence design, can not only roll-to-roll, but also piece-to-piece, no pressure point, no wheel mark, greatly improve the output, is the first in the industry.
Shenzhen address: 201, Building 2, Xinweirun High tech Park, No. 3 Shajiang Road, Xitou Community, Songgang Street, Bao'an District, Shenzhen.
Zhuhai address: Building 10, No. 111 Qilu, Qianwu Town, Zhuhai
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