Products

Products

Pre-treatment of copper plating

Equipment after material opening: deburring, pretreatment of copper sinking, ultrasonic cleaning after grinding plate, ultra-high pressure water washing (100KG), completely remove impurities in the hole.

Pre-treatment of copper plating

Inner layer pre-treatment

Pre-layer treatment: plate thickness: 0.05~4mm, after special micro-etching treatment, high-precision circuit, suitable for HDI and multi-layer circuit treatment.

Inner layer pre-treatment

Steel plate grinding plate cleaning line

Steel plate cleaning line: capacity: 1.5~4.0 plate thickness, production rate of 20 m/min. After pressing, the steel plate shall be polished and cleaned. Or coating centrifugal agent process. Complete removal of steel plate residues, and flow of glue. The pressed steel plate is injury-free and has a longer life. Pressing quality improvement

Steel plate grinding plate cleaning line

Cleaning processing line after cutting and grinding

Finished product cleaning line: capacity: 0.5~4.0 plate thickness, production rate of 3 m/min. Ultrasonic concussion, high-pressure water washing, water quality testing, to prevent oxidation, suitable for finished plate processing.

Cleaning processing line after cutting and grinding

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