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Our company designs, produces and sells vacuum etching machines with high precision, uniform etching of more than 95%, and etching factor of 4. Over-plate capacity: 0.05~3. Suitable for: multi-layer, HDI, metal etching, lead frame, ceramic board DBC,DPC,AMB carrier board production, etc.
Automatic plate grinding machine
Full-automatic grinding machine, precision grinding plate, suitable for PCB,FPC,HDI, ceramic carrier plate, deburring, line pretreatment, solder resist pretreatment, electroplating pretreatment, copper reduction treatment, resin plug hole grinding plate. Automatic pressure regulation, automatic whole brush, automatic plate thickness measurement, card alarm, automatic adjustment of transmission sprocket. Small vibration, small noise characteristics.
Two-fluid vertical development etching line
Two-fluid, vertical development etching
1) browning line: capacity: 0.05~3.2 plate thickness, production rate of 6 m/min. Suitable for HDI and multi-layer line fine line processing.
2) Process flow; incoming plate Þpickling ÞOverflow water washing (1)(2)) ÞAlkali washing ÞOverflow water washing (3)(4) ÞDI water washing Þpre-soaking Þbrowning ÞÞOverflow water washing (5)(6)(7)(8)ÞDI water washing and sucking dry the dry plate combination cooling outlet plate