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Horizontal browning line
Horizontal browning line
Horizontal browning line
Horizontal browning line
Horizontal browning line
Horizontal browning line
Horizontal browning line
Horizontal browning line
Horizontal browning line
Horizontal browning line
Horizontal browning line
Horizontal browning line
Horizontal browning line
Horizontal browning line

Horizontal browning line

1) browning line: capacity: 0.05~3.2 plate thickness, production rate of 6 m/min. Suitable for HDI and multi-layer line fine line processing. 2) Process flow; incoming plate Þpickling ÞOverflow water washing (1)(2)) ÞAlkali washing ÞOverflow water washing (3)(4) ÞDI water washing Þpre-soaking Þbrowning ÞÞOverflow water washing (5)(6)(7)(8)ÞDI water washing and sucking dry the dry plate combination cooling outlet plate

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Inner layer processing

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Horizontal browning line

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1) browning line: capacity: 0.05~3.2 plate thickness, production rate of 6 m/min. Suitable for HDI and multi-layer line fine line processing.

2) Process flow: into the plate (1)(2)(2) (3)(4) (DI) (5)(6)(7)(8) (DI)(7)(8) (DI)

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Horizontal black hole line (eclipse line)

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Horizontal vacuum etching line: capacity: 0.05~4.0 plate thickness, yield up to 5 m/min. Vacuum etching, the etching factor is above 4.0, and the etching uniformity is 96%. Suitable for fine lines of 2MI * 2MILd. Ultrasonic vibration, high pressure water washing, high pressure film, drum collection film slag, squeeze dry function.
Inner layer pre-treatment

Inner layer pre-treatment

Pre-layer treatment: plate thickness: 0.05~4mm, after special micro-etching treatment, high-precision circuit, suitable for HDI and multi-layer circuit treatment.

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