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Horizontal black hole line (eclipse line)
Soft board and hard board (black hole line): capacity: 0.035~3.0 board thickness, production speed up to 3~5 m/min. Suitable for soft board, fine hole processing. Special water knife arrangement, special wheel plate arrangement, special spray forest design, special overflow structure, to achieve no indentation, no wheel marks. Roll-to-roll and sheet-to-sheet co-production, easy to switch, production capacity increased. Intelligent production, plate collection, plate release, intelligent liquid medicine control, greatly reduce the cost, liquid medicine life extension.
Horizontal vacuum etching line: capacity: 0.05~4.0 plate thickness, yield up to 5 m/min. Vacuum etching, the etching factor is above 4.0, and the etching uniformity is 96%. Suitable for fine lines of 2MI * 2MILd. Ultrasonic vibration, high pressure water washing, high pressure film, drum collection film slag, squeeze dry function.
FPC horizontal shadow line (SHADOW)
Shenzhen Feishida Machinery Equipment Co., Ltd. continuously deepens and optimizes FPC wet process equipment, and improves the overall performance of domestic FPC wet process equipment to a new level. Black hole lines, black shadow lines, etc., such as mature applications from sheet-to-sheet to roll-to-roll; By the traditional PCL control, to the latest one-key scanning fully automatic industrial 4.0MES manufacturing execution system is fully applied. After years of research and development, RTR roll-to-roll and film-to-film sharing. Customers can switch different plates at any time, both roll-to-roll and piece-to-piece. 0.035~0.05 thick plate, no pressure point, no wheel mark. Greatly improve customer capacity and quality. Get customers praise. Create the first in the industry.
High precision vacuum etching line
The inner layer DES line designed by our company; development + vacuum precision etching + high-pressure film removing line, realize automatic connection, high precision vacuum etching, etching factor of 4.5, uniformity of 95%