Mass Production of Ceramic Plate DBC,DPC,AMB Automatic Grinding Machine

14 Mar,2023

According to the needs of the current semiconductor market, the demand for ceramic plates is increasing, the characteristics of ceramic plate substrates are more stringent, and processing is more difficult. When the ceramic plate is pre-treated, it is required to be smooth, the surface treatment is difficult, and it is easy to break. Ordinary grinding machine regardless of precision and capacity can not complete the type of processing.

Production of Semiconductor Devices on Ceramic Boards

11 Mar,2023

With the development of the electronic age and the rapid popularization of electronic information industries such as mobile communications, flat panel displays, solar photovoltaics and energy-saving lighting, electronic and electrical products continue to be digitized, miniaturized, flexible, multifunctional, high reliability, and low energy consumption. With the development of other directions, the closely related electronic packaging technology has entered a period of ultra-high-speed development. Ceramic circuit board packaging substrate material must meet the requirements: 1) High thermal conductivity, low dielectric constant, good heat resistance and pressure resistance; 2) The thermal expansion coefficient is close to the chip material Si or GaAs to avoid thermal stress damage of the chip; 3) It has sufficient strength and rigidity to support and protect the chip and electronic components; 4) The cost is as low as possible to meet the needs of large-scale industrial production applications; 5) Good processing, assembly and installation performance. Commonly used electronic packaging substrate materials include organic packaging substrates, metal matrix composite substrates and ceramic packaging substrates. Ceramic circuit boards have many advantages over traditional substrate materials: therefore, ceramic materials have gradually developed into an ideal packaging substrate for a new generation of integrated circuits and power electronic modules, and ceramic circuit board packaging technology has also received widespread attention and rapid development. Table 1 shows the performance comparison of commonly used ceramic packaging materials and Si. At present, commonly used ceramic substrate materials include Al2O3, SiC, BeO and AlN. Our company R & D production department a variety of ceramic plate equipment: 1) Ceramic grinding machine pretreatment: grinding substrate, sand scraping, polishing, pretreatment equipment 2) Ceramic plate development line, etching line, titanium removal line, film removal line, solder resist development, electroplating equipment, 3) Finished product cleaning machine

Application of vertical development etching equipment

18 Jun,2022

At present, the transmission of PCB equipment is mostly horizontal transmission, spraying up and down, which makes some problems unavoidable.

FPC's Shadow Line Process Flow (Shadow)

19 Jul,2020

The shadow process is suitable for high-end FPC ,5G products, and the mainstream process of high-end PFC, which is increasingly adopted by high-end FPC manufacturers. At present, the market mainly represents the potion merchants: Medemei, Les. Shenzhen Feishida Machinery Equipment Company and Medemei Company have successfully cooperated with many pieces of equipment, and many companies are in mass production.

Acid etching automatically added

27 Jun,2020

Recently, due to the rapid growth of our orders, we have expanded production and started a garden-style factory with an area of 8000 square meters. Production capacity and image have been improved, and the enrollment of production staff has doubled. Meet production needs. The new workshop is clean and orderly, and the R & D office and the comprehensive office have a new look. Entertainment venues complete, table tennis table, staff after work entertainment. With a new mental outlook, to provide customers with better service.

Comprehensive intelligent automated production to fill the loopholes in intelligent production

27 May,2020

At present, many PCB manufacturers have bought the ranks of industrial 4.0, and have greatly promoted the connection of various equipment to save people. Various equipment parameters enter the MES system, which is convenient for management and greatly improves the quality and output. But the continuous production of equipment, equipment maintenance can not be ignored. Due to automation and unmanned workshops, the number of operators is relatively small, and there is no manpower for maintenance.

Soft board FPC roll-to-roll production line

14 Sep,2023

Our company produces FPC roll-to-roll equipment. Development, etching, film removal, cleaning, sandblasting, OSP, shadow, black hole and other processes, automatic roll-to-roll winding, automatic roll-to-roll plate placement, automatic deviation correction, etc., automatic roll change. Save manpower and increase production capacity.

What are the common PCB boards?

16 Apr,2020

At present, the common PCB board materials on the market are mainly insulating materials, metal copper and solder. Moreover, our common PCB boards can be divided into three types of single-sided PCB boards, double-sided PCB boards and multi-layer PCB boards. See specific introduction below: