Products

Inner layer processing

DBC,DPC,AMB ceramic carrier development line

Shenzhen Feishida Machinery Equipment Co., Ltd. produces horizontal development lines, unique spray design, and professional processes. It is suitable for line development and solder resist production of DBC, DPC and AMB ceramic carrier plates.

DBC,DPC,AMB ceramic carrier development line

DBC,DPC ,AMB Ceramic Semiconductor Equipment

Our company develops and produces a variety of ceramic semiconductor special equipment, unique design, unique production. It is suitable for various processes of ceramic plates: DBC,DPC,AMB, etc., development line, vacuum etching line, film removal line, titanium removal line, red coating line, red washing line, OSP, silver chemical line, grinding plate, slag scraping, polishing, copper reduction, leveling of various materials of ceramic plates, with single brush, double brush and four brushes in different combinations. Meet different manufacturers, different products, different output of the whole process equipment.

DBC,DPC ,AMB Ceramic Semiconductor Equipment

Horizontal descaling slag sinking copper wire

Circuit conduction on the PCB board is conducted by lines or vias. As can be seen from the PCB manufacturing process, the completed copper thickness of the PCB consists of three parts: the thickness of the PCB base copper plus the thickness of the board electrical plus the thickness of the graph electrical. The thickness of the PCB hole copper is completed in two electroplating processes, I .e. the thickness of the full-board plated hole copper plus the thickness of the pattern plated hole copper. How to ensure the high reliability of PCB copper? This is closely related to the process, equipment and quality management system of PCB board factory.

Horizontal descaling slag sinking copper wire

Vacuum etching line

Vacuum DES line, suitable for high-end PCB,FPC,HDI, carrier board, hardware etching, lead frame, ceramic board DBC,DPC,AMB, etc. The equipment adopts imported nozzles, with accurate angle and stable flow rate. In addition, the unique arrangement of nozzles and vacuum design are added with unique swing spray plate design. Reach the precision line of regular customers. The etching factor reaches above 4. The uniformity is 95%. Speed 5 m/min.

Vacuum etching line

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