Horizontal descaling slag sinking copper wire
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Post-processing of cutting
Inner layer processing
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Horizontal descaling slag sinking copper wire
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Circuit conduction on the PCB board is conducted by lines or vias. As can be seen from the PCB manufacturing process, the completed copper thickness of the PCB consists of three parts: the thickness of the PCB base copper plus the thickness of the board electrical plus the thickness of the graph electrical. The thickness of the PCB hole copper is completed in two electroplating processes, I .e. the thickness of the full-board plated hole copper plus the thickness of the pattern plated hole copper. How to ensure the high reliability of PCB copper? This is closely related to the process, equipment and quality management system of PCB board factory.
Compared with the vertical sinking copper wire of the traditional process, the horizontal descaling copper wire has the following significant advantages:
1, the production efficiency is greatly improved, the delivery time is faster.
2. Excellent coating covering ability, excellent and reliable chemical copper deposition layer
3. Fast copper sinking speed and high palladium concentration
4, suitable for high aspect ratio plate production, aspect ratio can achieve 12:1
5. Better binding force between inner layer copper and hole copper
6. Fast deposition rate, no roughness and no coating separation
7. For blind holes that can deposit a good chemical copper layer, there is no pressure to make HDI board.

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