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Ceramic plate DBC,DPC,AMB DES vacuum etching line
Our company independently develops, produces and sells the ceramic plate vacuum time DES line, which is suitable for the production of ceramic carrier plate, ceramic substrate etching DBC,DPC,AMB, unique spray plate design, unique nozzle arrangement, high precision, 8.0 etching factor and etching thickness of 0.2~0.8MM.
Non-contact vertical development etching line
At present, most of the transmission of PCB equipment is horizontally transmitted, spraying up and down, which makes some problems unavoidable.
Ceramic Plate, DBC,DPC,AMB Automatic Plate Grinding Machine
Various processes of ceramic plates: such as DBC,DPC,AMB, substrate grinding, copper surface grinding, slag scraping, glue scraping, surface roughening, copper reduction, substrate reduction, dry film pretreatment, and leveling after electroplating.
Horizontal super-coarsening line
The ultra-roughening process is a unique and new process that can be used in the production of printed circuit boards to improve the bonding of dry film/ink to copper layers. Due to the increased complexity of printed circuit boards, including ultra-fine line width/line spacing and micro-via or blind via technology, and the application of new selective surface treatment processes, proper dry film/ink adhesion has become a key requirement.
Shenzhen address: 201, Building 2, Xinweirun High tech Park, No. 3 Shajiang Road, Xitou Community, Songgang Street, Bao'an District, Shenzhen.
Zhuhai address: Building 10, No. 111 Qilu, Qianwu Town, Zhuhai
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