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Surface treatment
Ceramic Plate, DBC,DPC,AMB Automatic Plate Grinding Machine
Various processes of ceramic plates: such as DBC,DPC,AMB, substrate grinding, copper surface grinding, slag scraping, glue scraping, surface roughening, copper reduction, substrate reduction, dry film pretreatment, and leveling after electroplating.
Horizontal super-coarsening line
The ultra-roughening process is a unique and new process that can be used in the production of printed circuit boards to improve the bonding of dry film/ink to copper layers. Due to the increased complexity of printed circuit boards, including ultra-fine line width/line spacing and micro-via or blind via technology, and the application of new selective surface treatment processes, proper dry film/ink adhesion has become a key requirement.
Line pre-treatment, solder resist pre-treatment, the need for rough surface, strengthen the binding force, you need grinding plate or sandblasting equipment: my company's production of automatic grinding plate sandblasting line, suitable for multi-layer, HDI, ceramic board, semiconductor, soft and hard combined board. Combined with high pressure water washing and ultrasonic washing.
DBC,DPC,AMB dedicated OSP antioxidant line
According to customer requirements, research and development, production, sales of DBC,DPC,AMB ceramic board special anti-oxidation line. Improve the antioxidant capacity of the product. Enhanced storage time.
Shenzhen address: 201, Building 2, Xinweirun High tech Park, No. 3 Shajiang Road, Xitou Community, Songgang Street, Bao'an District, Shenzhen.
Zhuhai address: Building 10, No. 111 Qilu, Qianwu Town, Zhuhai
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