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Surface treatment
Automatic plate grinding machine
Our company's own research and development, design, production and sales, full-automatic precision plate grinding machine, automatic pressure regulation, automatic plate thickness measurement, mute production, suitable for: PCB,FPC,HDI, ceramic plate and other plate grinding processes: deburring, solder resist pretreatment, line pretreatment, polishing, etc.
Pre-dry film (pre-solder mask) treatment line
Pretreatment line for solder mask: 0.035~4.0 plate thickness, speed 5 m 1 min, can be combined into various processes according to customer requirements: grinding plate sandblasting, grinding plate ultra-coarsening, sandblasting ultra-coarsening. Application: multi-layer board, HDI carrier board, hard and soft combination and other high-end requirements.
Full-automatic pressure regulating grinding machine
Fully automatic pressure regulating grinding machine: capacity: 0.3~4.0 plate thickness. Suitable for HDI and multi-layer circuit reduction copper, de-resin grinding plate. Automatic pressure regulation, front and rear lifting brush, prevent plate rolling from rotten plate, one-button automatic whole brush, card plate turnover, brush grinding life alarm and other functions.
Gold pretreatment: grinding plate sandblasting structure, capacity: 0.2~3.0 plate thickness, production rate of 3 m/min. Suitable for advanced board surface, fine processing. Special spray forest design, to achieve no color, no leakage sand structure. Stable performance!