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Post-processing of cutting
Ceramic Plate, DBC,DPC,AMB Automatic Plate Grinding Machine
Various processes of ceramic plates: such as DBC,DPC,AMB, substrate grinding, copper surface grinding, slag scraping, glue scraping, surface roughening, copper reduction, substrate reduction, dry film pretreatment, and leveling after electroplating.
Horizontal deburring conductive film (conductive adhesive) line
Our company R & D, production and sales, metal hole equipment: deburring conductive film equipment, also known as direct electroplating. Or conductive glue black hole line. Instead of sink copper wire and black hole wire.
Horizontal deburring conductive film (conductive adhesive) line
Horizontal descaling slag sinking copper wire
Circuit conduction on the PCB board is conducted by lines or vias. As can be seen from the PCB manufacturing process, the completed copper thickness of the PCB consists of three parts: the thickness of the PCB base copper plus the thickness of the board electrical plus the thickness of the graph electrical. The thickness of the PCB hole copper is completed in two electroplating processes, I .e. the thickness of the full-board plated hole copper plus the thickness of the pattern plated hole copper. How to ensure the high reliability of PCB copper? This is closely related to the process, equipment and quality management system of PCB board factory.
Special grinding machine for ceramic plate
Special grinding machine for ceramic plate, fully automatic, multi-function: fixed current or fixed height. For ceramic plates: scraping sand, reducing copper, polishing.
Shenzhen address: 201, Building 2, Xinweirun High tech Park, No. 3 Shajiang Road, Xitou Community, Songgang Street, Bao'an District, Shenzhen.
Zhuhai address: Building 10, No. 111 Qilu, Qianwu Town, Zhuhai
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