Test and acceptance method of copper foil in FPC black hole circuit board factory

Qualified raw materials are very important for electronics manufacturers, soFPC black hole wire manufacturersThe inspection of copper foil, one of the main base materials, is even more important. Its quality testing and acceptance methods are as follows, worthy of your collection and reference.

The sample material is 250 ㎜ wide and cut into 250 ㎜ × 480 ㎜. The cut material is subjected to SPS → film pressing → exposure → etching-DES to form the required line for testing (double-sided board is etched into single-sided board).

1.1 peeling resistance test: cut the etched circuit sample to an appropriate length (3.2mm × 20cm with glue copper; No glue copper 1mm × 20cm) and pull apart the copper foil 1~3cm, the PI surface of the copper foil substrate is attached to a 90-degree plane fixture, the upper fixture clamps the copper foil and pulls the copper foil surface 90 degrees upward, the pulling speed is 50 mm/min, and the average most stable pulling force value of the pulling force point is recorded, bake at 150 ℃ for 6hr and ring test (temperature 60 ℃/humidity 90RH/72H) to measure the tensile value of copper foil again and calculate the peel strength.

1.2 thermal stress test: cut the etched circuit sample into 3 pieces with a size of 2.5cm × 2.5cm, and bake (150 ℃;2hr) to remove its moisture, immerse it in a 288 ℃ tin bath (lead-free) for 10s and then take it out, and observe whether it has blistering and peeling.

1.3 Flexure Resistance Test: Cut the etched line sample to 1mm(6 strips) x 10cm for R0.8/Load500g (135 degrees left and right swing) flex resistance test, read the MIT value and record it.

1.4 chemical resistance test: cut the etched circuit sample into three pieces of 2.5cm × 2.5cm, and place it in the solvent (10% 2N HCL /10% 2N NaOH/10% MEK/10% IPA) at normal temperature for 5min to observe whether there is any liquid medicine attacking the circuit.

1.5 Buckling Resistance Test: The etched line sample was cut to 1mm(6 strips) x 10cm for R2/stroke 120 mm buckling resistance test, and the MIT value was read and recorded.

1.6 insulation resistance test: cut the etched line sample into a standard line, bake it (50 ℃/24hr), set the voltage to DC 500V, connect two test points with a test pen, test for 60s, read the value and record it.

Secondary precipitation of 1.7: cut the etched circuit samples to 1mm(18 pieces) × 10cm for compression bonding (temperature: 175 ℃; Preheating time: 10S; Forming time: 180S; Pressure: 100kg/cm2 ), nickel plating test is carried out by pretreatment after compression, and 30 times magnifying glass is used to observe whether there is copper exposure after nickel plating.

No secondary precipitation test is required for 1.8 glue-free copper. Three groups of samples are taken for each test of the above test items.

2. Dimensional stability test: The sample material is 250 ㎜ wide, cut into 250 ㎜ × 280 ㎜ and drill a hole with a diameter of 2.0mm at each corner of the plate. After measuring the original size, the copper is completely etched and removed. After washing with clear water, the copper is placed in an oven at 150 ℃ for baking for 30min. After standing at normal temperature for 24hr, the dimensional change is measured, the data is recorded, and the dimensional stability is calculated.

2.2 size stability judgment standard: no glue copper 0.1; Glue copper 0.15, R value is qualified within 0.05.

3.0 color card production: copper foil materials require suppliers to provide pure PI; One copy of the original color card of pure copper foil, and the raw materials of the sample delivery material (copper with glue: copper glue PI; Glue-free copper: copper PI) is used to make one color card forward and backward. The double-sided plate of the sample delivery material is etched into a single-sided plate. One color card is made forward and backward for FPC after yield test, A total of 8 copies of copper foil material color cards are produced.

4. Yield test: After the reliability test is completed, it is determined whether it meets the requirements of the factory. OK will carry out yield test, while NG does not need yield test.

The 4.1 R & D department applies for the production of test items, and the business department places an order for test items after receiving the R & D test notice. The design department assists in the production of test items.

4.2 According to the requirements of the research and development department, after the design of the new raw material sample is completed, the research and development department shall be notified to monitor the size expansion and shrinkage measurement at key stations (① after drilling; ② after exposure and film pressing; ③ after DES etching; ④ after CVL sandblasting; ⑤ after CVL pressing; ⑥ after processing and pressing; ⑦ after screen printing text; ⑧ after electroplating nickel gold), and to track the quality during the test.

After the 4.3 test is completed, analyze according to the defective items of the final inspection, integrate the test results, and report to the relevant departments (environmental safety room, quality assurance department, manufacturing department, manufacturing department, design department, purchasing department).

The above isFPC black hole wireA simple description of the copper foil test and acceptance method of the road board factory. If you have other related questions about sandblasting line, FPC black hole line and horizontal sinking copper line, you can contact us online in time for consultation.Shenzhen FPC Black Hole Wire Manufacturers.