PE water pump impeller

Horizontal browning line

1) Browning line: capacity: 0.05~3.2 plate thickness, production speed up to 6 m / min. Suitable for HDI and multi-layer fine line processing. 2) Process; sensible Þ Pickling Þ Overflow water washing (1) (2)) Þ Alkaline washing Þ Overflow water washing (3) (4) Þ DI water wash Þ Prepreg Þ Browning Þ Overflow washing (5) (6) (7) (8) Þ DI water wash Þ Blotting Þ Dry board combination Þ Cooling out plate

Horizontal black hole line (eclipse line)

Soft plate copper precipitation (black hole line): capacity: 0.035~1.0 plate thickness, production speed up to 3m / min. Suitable for soft board and fine hole processing. Special water jet arrangement, special wheel plate arrangement, special spray forest design and special overflow structure make it possible to achieve no indentation and no wheel mark. Roll to roll and piece to piece joint production, convenient switching and greatly increased production capacity. Intelligent production, plate collection and release, intelligent liquid medicine control, greatly reducing the cost and prolonging the service life of liquid medicine.

Inner layer pretreatment

Pre layer treatment: plate thickness: 0.05~4mm, special micro etching treatment, high-precision circuit, suitable for HDI and multi-layer circuit treatment.

Horizontal film stripping line

Horizontal film stripping line: capacity: 0.05~4.0 plate thickness, production speed up to 3m / min. Ultrasonic vibration, high-pressure water washing, high-pressure film stripping, drum to collect film slag, squeezing dry function.

FPC horizontal black shadow

Shenzhen feishida mechanical equipment Co., Ltd. continuously deepens and optimizes FPC wet process equipment, and improves the overall performance of domestic FPC wet process equipment to a new level. Black hole line, black shadow line, etc., such as mature application from film to film to roll to roll; From the traditional PCL control to the latest one key scanning full-automatic industrial 4.0mes manufacturing execution system. After years of research and development, our company has shared RTR roll to roll and chip to chip. Customers can switch between different plates at any time, which can be rolled to roll and slice to slice. 0.035~0.05 plate thickness, no pressure points, no wheel marks. Greatly improved customer productivity and quality. It has been highly praised by customers. Create the first in the industry. Shadow process; Micro etching - full hole - black shadow - fixing - drying - full hole - black shadow - fixing - drying - micro etching - water washing and drying

Steel plate grinding and cleaning line

Steel plate cleaning line: capacity: 1.5~4.0 plate thickness, production speed up to 20 m / min. Polish and clean the steel plate after pressing. Or centrifugal agent coating process. Completely remove the steel plate residue and glue flow. The pressed steel plate is injury free and its service life is prolonged. Improvement of pressing quality

Cleaning line after cutting and grinding

Finished product cleaning line: capacity: 0.5~4.0 plate thickness, production speed up to 3m / min. Ultrasonic vibration, high-pressure water washing, water quality detection, prevent oxidation, suitable for finished plate treatment.

Horizontal film washing line

Film cleaning line: capacity: 0.5~2.0 plate thickness, production speed up to 3m / min. Ultrasonic vibration, high-pressure water washing, water quality detection, prevent oxidation, suitable for finished plate treatment.

High precision development line

Inner des line designed by our company; Development + vacuum precision etching + high-voltage film removal line, realizing automatic connection. High precision vacuum etching, with an etching factor of 4.5, uniformity of 95%, plate thickness of 0.05~3.2mm, and line width of 2mil/2mil. It is equipped with an automatic adding system imported from Japan to monitor each section of liquid medicine and realize automatic pressure adjustment and monitoring for development, etching and film removal. The automation ability and unmanned degree are greatly improved. Suitable for HDI, high-density multilayer, packaging substrate, etc.