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Horizontal glue removal + horizontal black hole line (eclipse line)
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Inner Processing
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1
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Horizontal slag removal + horizontal black hole line: capacity: 0.035 ~ 1.0 plate thickness, production speed up to 3 meters / minute. Suitable for HDI and flexible boards, multi-layer circuit fine line processing. With pre-treatment, slag removal, black hole, automatic connection, greatly save manpower and maximize production capacity.
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