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DES (Development etching stripping line)
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真空蚀刻线
真空蚀刻线

DES (Development etching stripping line)

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DES line: Capacity: 0.035 ~ 4.0 board thickness, 2/2 dense line, high vacuum etching + high pressure stripping, etching uniformity is more than 95%, etching factor is 4.0. Suitable for HDI and multi-layer line fine line processing.

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