- PRODUCT CENTER -
- Product description
- Commodity name: Black shadow
The shadow process is applicable to the mainstream process of high-end FPC, 5g products and high-end PFC, and is increasingly adopted by high-end FPC manufacturers. At present, the main representative liquid medicine manufacturers in the market are McDermott and les. Shenzhen feishida mechanical equipment Co., Ltd. and McDermott have successfully cooperated in a number of equipment, and many companies are in mass production.
The shadow method mainly uses graphite as a conductive object. Because there are a lot of free electrons in the molecular structure of graphite, the conductivity of graphite is higher than that of carbon blackening. The electroplating speed is in direct proportion to the conductivity of the coating, so the higher the conductivity of the coating, the faster the electroplating speed.
The shadow direct metallization process is simple. It is mainly divided into five chemical tanks:
(2) Conductive collide
(3) Fuser slot
(4) Micro etch
(5) Anti oxidation tank (anti tarnish)
The anti-oxidation tank is more selective, which depends on the placement time of the production board.
The shadow method has horizontal and vertical production modes respectively. However, due to the long production time of the vertical production mode, which is less simple than the horizontal production mode, the company strongly recommends the shadow horizontal conveying production mode to replace the current traditional copper precipitation process.
Type of black shadow process chemicals
Cleaning / pore forming agent is a kind of slightly alkaline liquid. Its main function is to clean the pore wall surface and adjust the surface of glass fiber and epoxy resin as a condition. It is suitable for conductive colloids with sufficient adsorption capacity.
(2) Conductive colloid
Black shadow agent is a kind of slightly alkaline liquid, which contains unique additives and conductive colloidal substances to form a conductive layer on the hole wall.
Remove the excess black shadow agent on the hole wall, so that the black shadow conductive layer can be evenly distributed on the hole wall.
(4) Micro etch
The main components of the micro etchant are sodium persulfate and sulfuric acid. The main function of the micro etchant is to remove the dark shadow on the copper surface through side etching. Because the resin and glass fiber are inert, the micro etchant cannot remove the dark shadow on the sheet.
(5) Antioxidant (anti tarnish)
Anti oxidant is a slightly acidic liquid. Its purpose is to protect the copper surface from oxidation
Shadow process: plate feeding + micro etching + water washing + whole hole + shadow + fixing + water washing + dryingKey words: