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Line development line

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  • Product description
    • Commodity name: Line development line

    PCB/FPC horizontal development line: basic process: board entry + development + supplementary development + hot water washing + overflow water washing + suction + drying + plate making capacity: 0.05~3.0 plate thickness, 2/2 dense circuit, high development point. Strong uniformity. Suitable for HDI and multilayer fine line processing. With imported automatic adding system, the developing effect is greatly improved

    PCB/FPC horizontal development line: basic process: board entry + development + supplementary development + hot water washing + overflow water washing + suction + drying + plate making capacity: 0.05~3.0 plate thickness, 2/2 dense circuit, high development point. Strong uniformity. Suitable for HDI and multilayer fine line processing. With imported automatic adding system, the developing effect is greatly improved

    Key words:
    • 线路
    • 显影
    • 水洗
    • 精细
    • 添加
    • 处理
    • 密集
    • 系统
    • pcb

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