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- Commodity name: Line development line
PCB/FPC horizontal development line: basic process: board entry + development + supplementary development + hot water washing + overflow water washing + suction + drying + plate making capacity: 0.05~3.0 plate thickness, 2/2 dense circuit, high development point. Strong uniformity. Suitable for HDI and multilayer fine line processing. With imported automatic adding system, the developing effect is greatly improved
PCB/FPC horizontal development line: basic process: board entry + development + supplementary development + hot water washing + overflow water washing + suction + drying + plate making capacity: 0.05~3.0 plate thickness, 2/2 dense circuit, high development point. Strong uniformity. Suitable for HDI and multilayer fine line processing. With imported automatic adding system, the developing effect is greatly improved
Key words:- 线路
- 显影
- 水洗
- 精细
- 添加
- 处理
- 密集
- 系统
- pcb
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