Shadow Line
Classification:
Surface treatment
Keyword:
Shadow Line
Graphic Details
The shadow process is suitable for high-end FPC,5G products, and the mainstream process of high-end PFC, which is increasingly adopted by high-end FPC manufacturers. At present, the market mainly represents the potion merchants: Medemei, Les. Shenzhen Feishida Machinery Equipment Company and Medemei Company have successfully cooperated with many pieces of equipment, and many companies are in mass production.
The shadow method (Shadow) mainly uses graphite (Graphite) as a conductive object. Due to the graphite molecular structure, there are a large number of free electrons, so the conductivity of graphite than the general carbon blackening is high. The plating speed is proportional to the conductivity of the coating, so the higher the conductivity of the coating, the faster the plating speed.
Shadow direct metallization process (Shadow Direct Metallization Process) is simple, mainly divided into five chemical tank:
(1) Clean/Sole Groove (Cleaner/Conditioner)
(2) 黑影槽 (Conductive Colloid)
(3) Fixing slot (Fixer)
(4) Micro-etching groove (Micro-Etch)
(5) Anti-oxidation tank (Anti-Tarnish)
Among them, the anti-oxidation tank is more selective, depending on the time when the production plate is placed.
The shadow method has horizontal (Conveyor) and vertical (Vertical) production methods, but because the vertical production method takes a long time and is not as simple as the horizontal production, the company strongly recommend the shadow horizontal conveying production method to replace the traditional copper sinking process.
Black Shadow Process Chemical Agent Type
(1) Cleaning/pore-setting agent (Cleaner/Conditioner)
Cleaning/pore sizing agent is a slightly alkaline liquid, the main function is to clean the surface of the hole wall and as a pore sizing agent (Conditioner) to adjust the surface of glass fiber and epoxy resin suitable for conductive colloid has sufficient adsorption force.
(2) 黑影剂 (Conductive Colloid)
The black shadow agent is a slightly alkaline liquid, the composition contains unique additives and conductive colloidal substances, so that the pore wall to form a conductive layer.
(3) Fixer
Remove the excess black shadow agent on the pore wall, so that the shadow conductive layer can be more evenly distributed on the pore wall.
(4) Microinhibitor (Micro-Etch)
The main components of the micro-inhibitor are sodium persulfate and sulfuric acid. The main function of the micro-inhibitor is to remove the shadow on the copper surface through the side etching. Because the resin and the glass fiber are inert, the micro-inhibitor cannot remove the black shadow on the sheet.
(5) Antioxidant (Anti-Tarnish)
Antioxidant is a slightly acidic liquid, used to protect the copper surface, so that it is not easy to oxidize
Shadow process: micro-etching, washing, whole hole black shadow fixing, washing and drying
Key words:
Related Products
Pre-treatment of copper plating
Deburring (before copper sinking) processing line
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