FPC black hole circuit board factory copper foil test and acceptance method

Time of issue:

1970-01-01 08:00

Qualified raw materials are very important for electronic manufacturers, so as one of the main base materials of FPC black hole wire manufacturers, the inspection of copper foil is even more important. Its quality testing and acceptance methods are as follows, worth your collection and reference.

Take the sample material 250㎜ width, cut to 250㎜×480㎜, will be cut after the material for SPS→ pressure film → exposure → etch -DES test required line (double panel etch for single panel).

1.1 Anti-peel test: cut the etched line sample to an appropriate length (adhesive copper 3.2mm×20cm; Unglued copper 1mm×20cm) and pull copper foil 1 ~ 3cm, the PI surface of copper foil base material is attached to the 90 degree plane fixture, the upper fixture clamps the copper foil to pull the copper foil surface 90 degrees upward, the pulling speed is 50mm/min, and the average most stable tension point tension value is recorded. Bake at 150℃ for 6hr and ring test (temperature 60℃/ humidity 90RH/72H) to measure the copper foil tension value again and calculate the anti-peel strength.

1.2 Thermal stress test: cut the etched line sample into 3 pieces in size of 2.5cm×2.5cm and bake it (150℃; 2hr) remove its moisture, immerse it in a 288℃ tin tank (lead-free) for 10 seconds and take it out. Visually observe whether it has blistering and peeling phenomenon.

1.3 Flexural resistance test: Shear the etched line sample to 1mm(6)×10cm for R0.8/Load500g(135 degrees swing left and right) torsional resistance test, read the MIT value and record it.

1.4 Chemical resistance test: Cut the etched line sample into three pieces of 2.5cm×2.5cm, and place it in the solvent (10%2N HCL /10%2N NaOH/10%MEK/10%IPA) for 5min at normal temperature to observe whether the potion attacks the line.

1.5 Buckling test: Shear the etched line samples to 1mm(6)×10cm for R2/ stroke buckling test of 120 mm, read the MIT value and record it.

1.6 Insulation impedance test: Cut the etched line sample into a standard line, bake it (50℃/24hr), set the voltage to DC 500V, connect the two test points with a test pen, test time 60s, read the value and record it.

1.7 Secondary precipitation: Cut the etched line samples to 1mm(18)×10cm for pressing (temperature :175℃; Preheating time :10S; Molding time :180S; Pressure :100kg/cm2), nickel plating test was carried out after pressing and pretreatment. After nickel plating, a 30-fold magnifying glass was used to observe whether there was copper exposure.

1.8 No secondary precipitation test is required for glue-free copper. The above test items take three groups of samples for each test.

2. Size stability test: Take the sample material 250㎜ width, cut to 250㎜×280㎜ size and drill a diameter of 2.0mm hole in the four corners of the plate, measure the original size of the copper completely etched remove, with clean water after baking in 150℃ oven for 30min, room temperature standing 24hr after measuring the size change, record data, calculate the size stability.

2.2 Criteria for size stability: non-adhesive copper ±0.1%; Colloidal copper ±0.15%, R value within ±0.05% qualified.

3.0 Color card production: Copper foil material requires suppliers to provide pure PI; Pure copper foil original color card, will be sent samples of raw materials (plastic copper: copper + plastic +PI; Non-adhesive copper: copper +PI) one color card for positive and negative production, two panels of the sample material is etched into a single panel, one side retains the circuit, one side is PI surface, one color card for positive and negative production, after the yield test, one color card for positive and negative production of FPC, a total of 8 color cards for copper foil materials.

4. Yield test: determine whether to meet the requirements of the factory after the completion of the trust test, OK for yield test, NG is not required to carry out the yield test.

4.1 The R & D Department shall apply for the production of test material number, and the business department shall place the test material number order after receiving the r & D trial production notice, and the Design Department shall assist in the production of test material number.

4.2 According to the requirements of the R & D Department, after the use of the new raw material sample design is completed, inform the R & D Department to monitor the key station (① after drilling, ② after exposure and pressing film, ③ after DES etching, ④ after CVL sandblasting, ⑤ after CVL pressing, ⑥ after processing and pressing, ⑦ after screen printing, ⑧ after electroplating nickel gold) for size expansion and shrinkage measurement, and quality tracking in the test process.

4.3 After the completion of the test, analyze the defective items according to the inspection, integrate the test results, and countersign the report to relevant departments (environmental safety room, quality assurance Department, manufacturing Department, Design Department, purchasing Department).

The above is for the FPC black hole circuit board factory copper foil test and acceptance method of a simple description, if you have other sandblasting line, FPC black hole line, horizontal sunken copper wire related problems, you can timely contact us online consultation shenzhen FPC black hole line manufacturers.


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